New Siemens Partnership to Enhance BRIDG Efficiency

New Siemens Partnership to Enhance BRIDG Efficiency

Siemens announced a partnership with BRIDG Thursday, and also donated $30 million worth of specialized software to the wafer fabrication facility at NeoCity. The software is expected to make BRIDG’s senor manufacturing work more efficient and cost effective.

This is the first time Siemens has given its Digital Enterprise Solution software to a semiconductor facility. BRIDG is a unique institution designed as one of the world’s most flexible and adaptable fabrication facility focused on the manufacturing development of advanced technologies in smart sensors, imagers, advanced devices and 2.5D/3D chip integration. The University of Central Florida, Osceola County and the Florida High Tech Corridor Council were among its founding supporters.

The Siemens software suite gives BRIDG the ability to provide manufacturers the option of creating “digital twin” prototype or computerized models of objects to conduct extreme tests on them to check for durability, safety and other issues.

“Partners like Siemens help us develop and provide commercialization infrastructure, as well as the capability for proof of concept, custom development and pilot production,” said Chester Kennedy, Chief Executive Officer, BRIDG. “This also leverages the existing Siemens relationship with our visionary stakeholder, the University of Central Florida, and further solidifies Siemens commitment to our region. We look forward to working with Siemens to be the global leaders in the digital transformation of semiconductor manufacturing.”

Siemens has a long history of partnering and supporting UCF. Several company representatives serve on various advisory boards at the university helping ensure curriculum is aligned with industry needs. The company last year donated software — with a commercial value of $68 million  — to the College of Engineering and Computer Science so its students can learn the programs that working engineers use in the field. Additionally, hundreds of UCF students also have completed internships or other work study opportunities at both company locations in Orlando and Germany. And several active alumni are Siemens employees.

Through this partnership, the new BRIDG Digital Enterprise program will feature the complete Siemens product lifecycle management (PLM) portfolio, ranging from requirements management, product design, simulation, manufacturing and yield management to product performance analytics. Manufacturers in the semiconductor industry can use this digital enterprise solution to help improve manufacturing throughput, and overall cost effectiveness across the lifecycle of their products.

“BRIDG is in a unique position to advance innovation in the semiconductor industry as well as other industries with their smart manufacturing wafer fabrication facility dedicated to new product launch in the IoT segment,” said Rob Rudder, vice president, Siemens PLM Software. “Siemens is proud to partner with BRIDG and provide our Digital Enterprise Solution to help accelerate innovation in the manufacturing development of advanced technologies in smart sensors.”

Siemens PLM Software, a business unit of the Siemens Digital Factory Division, is a leading global provider of software solutions to drive the digital transformation of industry, creating new opportunities for manufacturers to realize innovation. With headquarters in Plano, Texas, and over 140,000 customers worldwide, Siemens PLM Software works with companies of all sizes to transform the way ideas come to life, the way products are realized, and the way products and assets in operation are used and understood.

BRIDG includes approximately 60,000 square feet of cleanroom laboratory/manufacturing space for use by its industry partners. It is currently installing high tech equipment that will provide clients an opportunity to push their innovations.

For more information about BRIDG click here.